# US 9,882,327 B2 · Memory card adapter > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,882,327 B2 - Document ID: US9882327B2 - Status: Granted - Kind: B2 - Application number: 15/404,707 - Filed: 2017-01-12 - Published: 2017-05-04 - Granted: 2018-01-30 - Earliest claimed: 2012-11-08 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Seok-Jae Han; Jeongsik Yoo; So-Young Jung - Web page: https://patentgrep.com/patent/US9882327B2 ## CPC - H01R 31/06: Intermediate parts for linking two coupling parts, e.g. adapter (with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94) - G06K 19/07739: {comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor} - H01R 12/721: {cooperating directly with the edge of the rigid printed circuits} - H04B 1/3816: Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices - H05K 5/0247: {Electrical details of casings, e.g. terminals, passages for cables or wiring} - G06K 19/07737: {the record carrier consisting of two or more mechanically separable parts} - H01R 27/00: Coupling parts adapted for co-operation with two or more dissimilar counterparts ({for dissimilar contact members H01R13/35}; supported only by co-operation with a counterpart H01R31/00; with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/90) - H01R 27/02: for simultaneous co-operation with two or more {dissimilar} counterparts - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H04B: TRANSMISSION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A memory card adapter includes a body having a set of contact pins. The set of contact pins include input pins and output pins implemented in a pin-to-pin structure. The input pins connect with pins of an inserted memory card and the output pins connect with an external socket. The body includes a bottom lead adapted to support the main body, and a top lead adapted to be combined with the bottom lead. The body includes a fixing substance adapted to combine with the contact pins. The body includes a conduction plate on a top surface or a bottom surface of the fixing substance, where the conduction plate is connected to at least one of the contact pins. ## Claims ### Claim 1 A memory card adaptor, comprising: a package substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface; a first layer on the first surface, the first layer including a plurality of contact pads, a plurality of contact lands and a conduction area, the plurality of contact pads being configured to contact a card socket and the plurality of contact lands configured to be connected with the plurality of contact pads, and at least a portion of the conduction area being located between the contact pads and the contact lands, wherein the contact pads include data pads, a command pad, a clock pad, a power pad and a ground pad; a second layer on the second surface, the second layer including a plurality of signal lines, each of the plurality of signal lines being connected to a corresponding contact pad and contact land respectively through a plurality of via holes, the plurality of via holes being formed to penetrate the package substrate; and a plurality of contact pins configured to connect the plurality of contact lands to a memory card when the memory card is inserted into the memory card adaptor, wherein the conduction area is connected to one of the power pad and the ground pad to operate as a return path for at least one of the signal lines. ### Claim 2 (depends on 1) The memory card adaptor of claim 1, wherein the memory card adaptor further includes a housing which comprises a bottom lid and a top lid and substantially encloses the package substrate, and the package substrate is fixed to the bottom lid. ### Claim 3 (depends on 1) The memory card adaptor of claim 1, wherein the conduction area is planar shaped and at least one of the plurality of the signal lines is located adjacent to the conduction area. ### Claim 4 (depends on 1) The memory card adaptor of claim 1, wherein the package substrate is a printed circuit board. ### Claim 5 (depends on 1) The memory card adaptor of claim 1, wherein each of the plurality of contact pins has a first end and a second end, the first end being electrically connected with corresponding contact land, and the second end being located at a groove of the package substrate for being contacted with a memory card when the memory card is inserted. ### Claim 6 (depends on 1) The memory card adaptor of claim 1, wherein at least a portion of each contact pin is projected from the package substrate. ### Claim 7 (depends on 1) The memory card adaptor of claim 1, wherein the first layer further includes a second signal line which connects one of the contact pads with a corresponding contact land, the second signal line does not pass through a via hole, wherein the second signal line is neither the power pad nor the ground pad. ### Claim 8 (depends on 7) The memory card adaptor of claim 7, wherein the second layer further includes a second conduction area, wherein the second conduction area is electrically connected to one of the power pad and the ground pad through the via hole. ### Claim 9 (depends on 1) The memory card adaptor of claim 1, wherein the power pad or the ground pad is connected to the conduction area through a wiring disposed on the first layer. ### Claim 10 (depends on 1) The memory card adaptor of claim 1, wherein at least two of the plurality of via holes are used to electrically connect a contact pad and a contact land. ### Claim 11 (depends on 1) The memory card adaptor of claim 1, wherein a first pitch between the plurality of contact pads is larger than a second pitch between the plurality of contact lands. ### Claim 12 (depends on 1) The memory card adaptor of claim 1, wherein at least one portion of the plurality of contact pads are connected to via holes with wirings and at least another portion of the plurality of contact pads are connected to via holes directly without wirings. ### Claim 13 A memory card adaptor, comprising: a package substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface; a first layer on the first surface, the first layer including a plurality of contact pads, a plurality of contact lands and a conduction area, the plurality of contact pads being configured to contact a card socket directly, and the plurality of contact lands configured to be connected with the plurality of contact pads, and at least a portion of the conduction area being located between the contact pads and the contact lands, wherein the contact pads include data pads, a command pad, a clock pad, a power pad and a ground pad, wherein total pitches of the contact lands are substantially smaller than that of the contact pads; a second layer on the second surface, the second layer including a plurality of signal lines, each of the plurality of signal lines being connected to a corresponding contact pad and contact land respectively through a plurality of via holes, the plurality of via holes being formed to penetrate the package substrate; and a plurality of contact pins, each of the plurality of contact pins having a first end and a second end, the first end being electrically connected with a corresponding one of the contact lands and the second end being protruded from the package substrate, and the plurality of contact pins being configured to connect the plurality of contact lands with a memory card when the memory card is inserted into the memory card adaptor wherein the conduction area is connected to one of the power pad and the ground pad to operate as a return path for at least one of the signal lines. ### Claim 14 (depends on 13) The memory card adaptor of claim 13, wherein a first pitch between the plurality of contact pads is larger than a second pitch between the plurality of contact lands. ### Claim 15 (depends on 13) The memory card adaptor of claim 13, wherein the memory card adaptor further includes a housing which comprises a bottom lid and a top lid and substantially encloses the package substrate, and the contact pads are exposed out from the housing. ### Claim 16 (depends on 13) The memory card adaptor of claim 13, wherein the package substrate is a printed circuit board. ### Claim 17 (depends on 13) The memory card adaptor of claim 13, wherein at least two of the plurality of via holes are used to electrically connect a contact pad and a contact land. ### Claim 18 (depends on 13) The memory card adaptor of claim 13, wherein the memory card adaptor does not include a semiconductor chip. ### Claim 19 (depends on 13) The memory card adaptor of claim 13, wherein total pitches of the contact lands are substantially smaller than a width or a length of the package substrate.