Encapsulation structure, encapsulating method and display device
AssigneeBoe Technology Group Co., Ltd.
InventorRui Hong
Life of this patent
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Abstract
Embodiments of the present disclosure disclose an encapsulation structure, an encapsulating method and a display device. The encapsulation structure includes a first substrate and a second substrate arranged opposite to each other, and a sealing structure provided between the first substrate and the second substrate. Wherein the sealing structure is provided with one or more voids, and a filler is provided within the one or more voids and includes a gas-absorbing material.
Claims18
An encapsulation structure, comprising a first substrate and a second substrate arranged opposite to each other, a sealing structure provided between the first substrate and the second substrate, and provided with one or more voids, and a filler provided within the one or more voids and including a gas-absorbing material and a heat-absorbing material to mitigate strains and stresses caused by a change in temperature of the sealing structure.
An encapsulating method comprising:
- providing a first substrate;
- providing a second substrate;
- and
- coupling the first substrate to the second substrate,
- wherein a sealing structure is provided between the first substrate and the second substrate, wherein the sealing structure is provided with one or more voids and non-void parts, and wherein a filler is provided within the one or more voids and includes a gas-absorbing material and a heat-absorbing material to mitigate strains and stresses caused by a change in temperature of the sealing structure.
Dependencies are inferred from the claim text.