Semiconductor package with three-dimensional antenna
AssigneeMediatek Inc.
InventorsChih-Chun Hsu, Sheng-Mou Lin
Life of this patent
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Abstract
A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region. A semiconductor die is disposed on the package substrate in the first region. A three-dimensional (3D) antenna is disposed on the package substrate in the second region. The 3D antenna includes a planar structure portion and a bridge or wall structure portion. A molding compound encapsulates the semiconductor die and at least a portion of the 3D antenna. A conductive shielding element is inside the molding compound or partially covers the molding compound. A semiconductor package assembly having the semiconductor package is also provided.
Claims26
A semiconductor package, comprising:
- a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region;
- a semiconductor die disposed on the package substrate in the first region;
- a conductive shielding element disposed on the package substrate and covering the semiconductor die;
- a three-dimensional (3D) antenna, comprising:
- a planar structure portion disposed on the package substrate in the second region;
- and
- a bridge structure portion above the planar structure portion and connected thereto;
- and
- a molding compound encapsulating the conductive shielding element and the 3D antenna.
A semiconductor package, comprising:
- a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region;
- a molding compound disposed on the package substrate in the first and second regions;
- a semiconductor die disposed on the package substrate in the first region and inside the molding compound;
- a three-dimensional (3D) antenna, comprising:
- a planar structure portion on the package substrate in the second region;
- and
- a wall structure portion contacting the planar structure portion and covering a top surface or one of sidewalls of the molding compound in the second region;
- and
- a conductive shielding element comprising:
- a spacer portion between the 3D antenna and the semiconductor die and passing through the molding compound;
- and
- a U-shaped wall portion covering the sidewalls of the molding compound in the first region and separated from the wall structure portion of the 3D antenna.
A semiconductor package assembly, comprising:
- a printed circuit board (PCB) having a keep-out region;
- a package substrate disposed on the PCB, wherein the package substrate has a first region and a second region defined between an edge of the package substrate and an edge of the first region and corresponding to the keep-out region;
- a semiconductor die disposed on the package substrate in the first region;
- a conductive shielding element disposed on the package substrate and covering the semiconductor die;
- a three-dimensional (3D) antenna, comprising:
- a planar structure portion disposed on the package substrate in the second region;
- and
- a bridge structure portion above the planar structure portion and connected thereto;
- and
- a molding compound encapsulating the conductive shielding element and the 3D antenna.
A semiconductor package assembly, comprising:
- a printed circuit board (PCB) having a keep-out region;
- a package substrate disposed on the PCB, wherein the package substrate has a first region and a second region defined between an edge of the package substrate and an edge of the first region and corresponding to the keep-out region;
- a molding compound disposed on the package substrate in the first and second regions;
- a semiconductor die disposed on the package substrate in the first region and inside the molding compound;
- a three-dimensional (3D) antenna, comprising:
- a planar structure portion on the package substrate in the second region;
- and
- a wall structure portion contacting the planar structure portion and covering a top surface or one of sidewalls of the molding compound in the second region;
- and
- a conductive shielding element comprising:
- a spacer portion between the 3D antenna and the semiconductor die and passing through the molding compound;
- and
- a U-shaped wall portion covering the sidewalls of the molding compound in the first region and separated from the wall structure portion of the 3D antenna.
Dependencies are inferred from the claim text.