Photo-curable and thermo-curable resin composition and dry film solder resist
AssigneeLG Chem, Ltd.
InventorsMin Su Jeong, Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Kwang Joo Lee
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Abstract
The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (—COOH) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator.
Claims16
A photo-curable and thermo-curable resin composition, including:
- an acid-modified oligomer having carboxyl group (—COOH) and photo-curable unsaturated functional group;
- a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups;
- a polyamic acid having a weight average molecular weight of 10,000 to 100,000,, which has no photo-curable property, and is not miscible with the acid-modified oligomer and the photo-polymerizable monomer;
- a thermo-curable binder having thermo-curable functional group;
- and
- a photoinitiator,
- wherein the content of the polyamic acid is 1 to 30 weight % based on the total weight of the resin composition, and
- wherein a dry film solder resist formed from said resin composition has an average roughness (Rz) of 2 to 20 μm of microunevenness.
Dependencies are inferred from the claim text.