# US 9,873,273 B2 · Gas enclosure systems and methods utilizing multi-zone circulation and filtration > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,873,273 B2 - Document ID: US9873273B2 - Status: Granted - Kind: B2 - Application number: 15/046,381 - Filed: 2016-02-17 - Published: 2016-08-18 - Granted: 2018-01-23 - Earliest claimed: 2014-07-18 - Assignees: Kateeva, Inc. - Applicants: Kateeva, Inc. - Inventors: Justin Mauck; Alexander Sou-Kang Ko; Eliyahu Vronsky; Prahallad Iyengar; Digby Pun - Web page: https://patentgrep.com/patent/US9873273B2 ## CPC - B41J 29/02: Framework - B01D 46/0039: {with flow guiding by feed or discharge devices} - B41J 2/01: Ink jet - B41J 29/06: Special supports, platforms or trolleys for supporting machines on tables - B41J 29/377: Cooling or ventilating arrangements - H10K 71/13: using printing techniques, e.g. ink-jet printing or screen printing - H10K 71/135: {using ink-jet printing} - H10K 71/40: Thermal treatment, e.g. annealing in the presence of a solvent vapour - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - B01D: SEPARATION (separating solids from solids by wet methods B03B, B03D; by pneumatic jigs or tables B03B; by other dry methods B07; magnetic or electrostatic separation of solid materials from solid materials or fluids, separation by high-voltage electric fields B03C; centrifuges, vortex apparatus B04; presses per se for squeezing-out liquid from liquid-containing material B30B9/02; treatment of water C02F, e.g. softening by ion-exchange C02F1/42; {arrangements of air intake cleaners in gas turbine plants F02C7/05} ; arrangements or mounting of filters in air-conditioning, air-humidification or ventilation F24F13/28) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices. Accordingly, various embodiments of a gas circulation and filtration system as disclosed herein can effectively remove both airborne particulate matter, as well as particulate matter generated proximal to a substrate during a printing process. As such, various embodiments of a gas circulation and filtration system in conjunction with various embodiments of a gas purification system of the present teachings can provide for a controlled manufacturing environment resulting in a high-yield of OLED various devices. ## Claims ### Claim 1 A method for printing comprising: housing a printing system in a gas enclosure defining an interior, wherein the gas enclosure is configured to provide a controlled processing environment for an enclosed printing system; circulating gas in a tunnel circulation and filtration zone, wherein a tunnel circulation and filtration system is configured to provide circulation and filtration of gas in a tunnel enclosure section of the gas enclosure; circulating gas in a bridge circulation and filtration zone, wherein a bridge circulation and filtration system is configured to provide circulation and filtration in a printing system bridge enclosure section of the gas enclosure; positioning a substrate proximal to a printhead assembly, wherein a motion system of the printing system is configured to provide relative motion between the substrate and the printhead assembly; and depositing an ink in a desired location on the substrate. ### Claim 2 (depends on 1) The method of claim 1, wherein the tunnel circulation and filtration system provides circulation and filtration of gas across the direction of substrate travel. ### Claim 3 (depends on 1) The method of claim 1, wherein the gas circulated in the bridge circulation and filtration system provides circulation and filtration of gas away from the substrate positioned proximal to the printhead assembly. ### Claim 4 (depends on 1) The method of claim 1, wherein the deposition of an ink forms a patterned layer. ### Claim 5 (depends on 4) The method of claim 4, wherein the patterned layer is an organic encapsulation layer. ### Claim 6 (depends on 4) The method of claim 4, wherein the patterned layer is at least one of an OLED stack layer. ### Claim 7 (depends on 1) The method of claim 1, wherein the controlled processing environment is a controlled gas environment. ### Claim 8 (depends on 7) The method of claim 7, wherein the controlled gas environment is maintained below specified limits of reactive gaseous species. ### Claim 9 (depends on 8) The method of claim 8, wherein the reactive gaseous species are water vapor, ozone, and oxygen that are maintained below 100 parts-per-million for each species. ### Claim 10 (depends on 7) The method of claim 7, wherein the controlled gas environment is maintained at or near atmospheric pressure. ### Claim 11 (depends on 7) The method of claim 7, wherein the controlled gas environment is a non-reactive gas environment. ### Claim 12 (depends on 11) The method of claim 11, wherein the non-reactive gas environment is maintained using nitrogen. ### Claim 13 (depends on 1) The method of claim 1, wherein the controlled processing environment is maintained below specified limits of particulate contamination level. ### Claim 14 (depends on 13) The method of claim 13, wherein the specified limit of particulate contamination level comprises an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 2 μm in size. ### Claim 15 (depends on 1) The method of claim 1, wherein a thermal regulation system is configured to provide a thermally controlled process environment. ### Claim 16 (depends on 1) The method of claim 1, wherein the printing system is configured to perform a printing procedure on a substrate having a size of about generation 3.5 to about generation 10.