# US 9,873,141 B2 · Filler layer forming method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,873,141 B2 - Document ID: US9873141B2 - Status: Granted - Kind: B2 - Application number: 15/148,369 - Filed: 2016-05-06 - Published: 2016-11-17 - Granted: 2018-01-23 - Earliest claimed: 2015-05-15 - Assignees: SCREEN Holdings Co., Ltd. - Applicants: SCREEN Holdings Co., Ltd. - Inventors: Naozumi Fujiwara; Naoko Yamaguchi - Web page: https://patentgrep.com/patent/US9873141B2 ## CPC - B08B 7/0071: {by heating (B08B7/0035 takes precedence)} - B08B 3/02: Cleaning by the force of jets or sprays - B08B 3/08: the liquid having chemical or dissolving effect - H10P 70/20: {Cleaning during device manufacture} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like} - B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A large number of pattern elements stands upright on an upper surface of a substrate. After the upper surface of the substrate has been processed using a processing liquid, liquid filling processing for filling the upper surface with a filler solution is performed, in which the filler solution having a viscosity of three centipoises or more is applied to a central part of the upper surface. Then, by rotating the substrate at 1000 revolutions per minute or less, the processing solution adhering to the entire upper surface is replaced by the filler solution, and a solution layer of a predetermined thickness is formed. In this way, making the viscosity of the filler solution relatively high and making the centrifugal force acting at the time of rotating the substrate relatively low suppresses deformation of the pattern elements at the time of filling with a filler that uses the filler solution. ## Claims ### Claim 1 A filler layer forming method for filling a main surface of a substrate having a pattern formed thereon with a filler solution after said main surface has been processed using a processing liquid, to form a filler layer, the method comprising: a) applying a filler solution having a viscosity of three centipoises or more to a central part of a main surface of a substrate, said main surface having a large number of pattern elements that stand upright; b) replacing a processing liquid that adheres to an entirety of said main surface with said filler solution and forming a solution layer of a predetermined thickness by rotating said substrate at V revolutions per minute or less, where V is a value obtained by multiplying a square root of (150/r) by 1000 and r is a radius of said substrate in millimeters; and c) baking said substrate to solidify said solution layer and form a filler layer. ### Claim 2 (depends on 1) The filler layer forming method according to claim 1, wherein said filler solution contains water as a solvent. ### Claim 3 (depends on 1) The filler layer forming method according to claim 1, wherein said filler solution contains a surface tension reducing agent. ### Claim 4 (depends on 3) The filler layer forming method according to claim 3, wherein said surface tension reducing agent is isopropyl alcohol. ### Claim 5 (depends on 1) The filler layer forming method according to claim 1, wherein said filler solution has a viscosity of 15 centipoises or less. ### Claim 6 (depends on 1) The filler layer forming method according to claim 1, wherein the number of revolutions of said substrate in said operation b) is 300 revolutions per minute or more. ### Claim 7 (depends on 1) The filler layer forming method according to claim 1, wherein tip ends of pattern elements that are adjacent to each other among said large number of pattern elements are coupled to each other by a bridge that extends along said main surface. ### Claim 8 A filler layer forming method for filling a main surface of a substrate having a pattern formed thereon with a filler solution after said main surface has been processed using a processing liquid, to form a filler layer, the method comprising: a) applying a filler solution to a central part of a main surface of a substrate, said main surface having a large number of patter elements that stand upright; b) replacing a processing liquid that adheres to an entirety of said main surface with said filler solution and forming a solution layer of a predetermined thickness by rotating said substrate; and c) baking said substrate to solidify said solution layer and form a filler layer, wherein a viscosity of said filler solution applied in said operation a) and a number of revolutions of said substrate in said operation b) are set to conditions that suppress occurrence of a void in said filler layer. ### Claim 9 (depends on 8) The filler layer forming method according to claim 8, wherein said filler solution contains water as a solvent. ### Claim 10 (depends on 8) The filler layer forming method according to claim 8, wherein said filler solution contains a surface tension reducing agent. ### Claim 11 (depends on 10) The filler layer forming method according to claim 10, wherein said surface tension reducing agent is isopropyl alcohol. ### Claim 12 (depends on 8) The filler layer forming method according to claim 8, wherein said filler solution has a viscosity of 15 centipoises or less. ### Claim 13 (depends on 8) The filler layer forming method according to claim 8, wherein the number of revolutions of said substrate in said operation b) is 300 revolutions per minute or more. ### Claim 14 (depends on 8) The filler layer forming method according to claim 8, wherein tip ends of pattern elements that are adjacent to each other among said large number of pattern elements are coupled to each other by a bridge that extends along said main surface.