Transceiver module having improved metal housing for EMI containment

A transceiver module comprising:

• a printed circuit board including opposite inner end portion and outer end portion in a front-to-back direction;
• a metallic housing enclosing said printed circuit board and including a metallic base portion made by a metallic die-casting process with strong rigidity thereof, and a metallic cover assembled, in a vertical direction perpendicular to said front-to-back direction, upon the base portion and made by stamping and forming sheet metal with resiliency thereof;
• said base portion including an inner mating port in which said inner end portion of the printed circuit board is located, an outer mating port around which said outer end portion of the printed circuit board is located, and a connecting portion located between said inner mating port and said outer mating port in said front-to-back direction;
• wherein
• the outer mating port defines a four-sided structure for coupling to at least one optical fiber connector, the inner mating port defines a three-sided structure to efficiently sidewardly and downwardly protectively shield the inner end portion of the printed circuit board;
• wherein
• the cover includes a bottom wall and two opposite side walls assembled upon the connecting portion to commonly form a hollow configured to have the printed circuit board loaded along said vertical direction.

A transceiver module comprising:

• a printed circuit board including opposite inner end portion and outer end portion in a front-to-back direction;
• a metallic housing enclosing said printed circuit board and including a metallic base portion made by a metallic die-casting process with strong rigidity thereof, and a metallic cover assembled, in a vertical direction perpendicular to said front-to-back direction, upon the base portion and made by stamping and forming sheet metal with resiliency thereof;
• said base portion including an inner mating port in which said inner end portion of the printed circuit board is located, an outer mating port around which said outer end portion of the printed circuit board is located, and a connecting portion located between said inner mating port and said outer mating port in said front-to-back direction;
• wherein
• the inner mating port defines a three-sided structure to efficiently sidewardly and downwardly protectively shield the inner end portion of the printed circuit board;
• wherein
• the cover includes a bottom wall and two opposite side walls assembled upon the connecting portion to commonly form a hollow configured to have the printed circuit board loaded therein along the vertical direction;
• wherein
• the connecting portion defines a pair of side portions opposite to each other in a transverse direction perpendicular to both said vertical direction and said front-to-back direction with a height much less than those of both said outer mating port and said inner mating port in the vertical direction.