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US 9,872,409 B2Granted
Device module and method of manufacturing the same
AssigneeHosiden Corporation
InventorsTakeshi Isoda, Koji Shinoda
Life of this patent
Estimating the term…
Abstract
The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.
Claims15
A device module comprising:
- a base;
- a plastic part provided on the base;
- a device provided on the base and embedded in the plastic part, the device being a capacitive touch panel or a capacitive touch switch;
- a protecting part being a rectangular insulating plastic block affixed to the plastic part;
- and
- an external connection, the external connection including:
- an embedded portion being connected to the device, extending from the device to an end of the base on and along the base such as to follow a shape of the base, and being embedded in the plastic part, and
- a lead-out portion being contiguous with the embedded portion and led out of the plastic part so as to be located outside the plastic part, wherein the lead-out portion includes at least a first part and a second part, wherein the first part of the lead-out portion is embedded in the protecting part, wherein the second part of the lead-out portion is not contained by the device module.
5 more elements
Dependencies are inferred from the claim text.