Implementing backdrilling elimination utilizing via plug during electroplating
AssigneeInternational Business Machines Corporation
InventorsMatthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
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Abstract
A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.
Claims12
A method for implementing enhanced via creation without creating a via barrel stub during printed circuit board (PCB) manufacturing comprising:
- providing a printed circuit board (PCB);
- said printed circuit board (PCB) having an internal conductive trace;
- forming a via extending through the printed circuit board (PCB) including the internal conductive trace;
- inserting a via plug into the via, said via plug having a capillary extending through said via plug;
- and
- performing PCB plating.
Dependencies are inferred from the claim text.