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US 9,872,397 B2Granted
Symmetrical hexagonal-based ball grid array pattern
AssigneeIntel Corporation
InventorGary Brist
Life of this patent
Estimating the term…
Abstract
The present disclosure provides techniques for creating a symmetrical ball grid array pattern for an integrated circuit package. The ball grid array includes a symmetrical pattern of circuit connection points, wherein the symmetrical pattern is derived from a base hexagonal pattern that is repeated in at least one or more sections of the ball grid array.
Claims26
A ball grid array for an integrated circuit package, comprising:
- a symmetrical pattern of circuit connection points, wherein the symmetrical pattern is derived from a base hexagonal pattern that is repeated in a plurality of sections of the ball grid array and the plurality of sections are separated by lines of demarcation, and wherein the circuit connections points do not occur in an area between the plurality of sections and the integrated circuit package shape is square with the hexagonal patterns oriented such that each hexagonal pattern is rotated ninety degrees when compared to a hexagonal pattern located in an adjacent section located clockwise to a first section.
A ball grid array package, comprising:
- a substrate having a top surface and a bottom surface;
- an array of contact pads arranged on the bottom surface of the substrate;
- and
- a plurality of solder balls attached to the contact pads, wherein the contact pads and solder balls are arranged in a plurality of sections that are separated by lines of demarcation, and wherein the contact pads and solder balls do not occur in an area between the plurality of sections, and the plurality of sections are oriented such that each section is rotated ninety degrees when compared to an adjacent section located clockwise to a first section.
1 more element
A system, comprising:
- a host computing system;
- a printed circuit board coupled to the host computing system;
- and
- an integrated circuit package coupled to the printed circuit board, wherein the integrated circuit package is coupled to the printed circuit board via solder balls arranged in a ball grid array pattern and the ball grid array pattern comprises a plurality of sections that are separated by lines of demarcation, and wherein the solder balls do not occur in an area between the plurality of sections and the plurality of sections are oriented such that each section is rotated ninety degrees when compared to an adjacent section located clockwise to a first section.
1 more element
A method, comprising:
- placing a hexagonal pattern of circuit connection points into a selected plurality of portions of an integrated circuit package wherein the plurality of portions are oriented such that that each portion is rotated ninety degrees when compared to an adjacent portion located clockwise to a first portion;
- altering the hexagonal pattern of circuit connection points such that the circuit connection points are not within a predetermined distance to an edge of the portions;
- and adding final connection points to a region of the integrated circuit package.
Dependencies are inferred from the claim text.