Component crimping apparatus
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsAkira Yamada, Shinjiro Tsuji, Satoshi Adachi, Yasutaka Tsuboi, Toshihiko Tsujikawa
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsAkira Yamada, Shinjiro Tsuji, Satoshi Adachi, Yasutaka Tsuboi, Toshihiko Tsujikawa
Estimating the term…
A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part that supports, by a transparent member, a region under the electrodes in the substrate; crimping tools that are juxtaposed over the transparent member and press the components to the substrate; and a light irradiating part that irradiates the adhesive member with light through the transparent member when the crimping tools press the components to the substrate. The crimping tools are configured movably in an arrangement direction of the crimping tools, the transparent member has a dimension capable of covering a whole region of a movable range of the crimping tools, and the light irradiating part irradiates a whole region of the transparent member with the light.
A component crimping apparatus comprising:
Dependencies are inferred from the claim text.