Method for making a circuit board
AssigneesAvary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Garuda Technology Co., Ltd.
InventorTzu-Chien Yeh
Life of this patent
Estimating the term…
Abstract
A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.
Claims5
A method for making a circuit board comprising:
- providing a supporting plate comprising a supporting portion and at least one first copper layer connected to at least one surface of the supporting portion;
- connecting at least one contact pad to a surface of each of the at least one first copper layer away from the supporting portion;
- connecting at least one passive component to a surface of each of the at least one contact pad away from the first copper layer;
- forming a first resin layer on a portion of each of the at least one first copper layer besides the passive component;
- disposing a core layer defining at least one through hole on a surface of each first resin layer away from the first copper layer to allow the passive component to be received in the through hole, and disposing a second resin layer and a second copper layer successively on each core layer and the passive component;
- pressing the two second copper layer causing the supporting portion, the first copper layer, the contact pad, the passive component, the first resin layer, the core layer, the second resin layer, and the second copper layer to be connected to each other to form a first intermediate product, wherein the first resin layer and the second resin layer flows to fill gaps between the first copper layer, the contact pad, the passive component, the core layer, and the second copper layer, thereby connecting to each other to from a resin packing layer;
- removing the supporting portion of the first intermediate product to form at least one second intermediate product;
- defining a plurality of plating holes at a portion of the first copper layer and the second copper layer, and a corresponding portion of the resin packing layer comprised in each of the at least one second intermediate product, an end of each of the plurality of plating holes being closed by one surface of the core layer;
- and
- forming a conductive portion in each of the plurality of plating holes which is electrically connected to the first copper layer, the second copper layer, and the core layer;
- and
- etching the first copper layer and the second copper layer to form a first conductive wire layer and a second conductive wire layer.
Dependencies are inferred from the claim text.