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US 9,872,390 B1Granted
Flexible interconnect
AssigneeMicrosoft Technology Licensing, LLC
InventorsJames David Holbery, Siyuan Ma, Michael David Dickey, Andrew L. Fassler
Life of this patent
Estimating the term…
Abstract
One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.
Claims18
An interconnect comprising:
- a substrate;
- a liquid conductive pathway supported by the substrate;
- a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element, the magnetic particle-embedded encapsulant being positioned at one or more terminal regions of the liquid conductive pathway;
- and an encapsulant that is not embedded with conductively anisotropic magnetic particles positioned in a central region of the liquid conductive pathway.
1 more element
A method of manufacturing an interconnect, the method comprising:
- depositing a liquid metal conductor to form a conductive path along a flexible substrate;
- applying an encapsulating layer over at least a portion of the liquid metal conductor, the encapsulating layer including a magnetic particle-embedded encapsulant applied over one or more terminal regions of the liquid metal conductor and an encapsulant that does not comprise magnetic particles over a central region of the liquid metal conductor;
- applying a magnetic field to the encapsulating layer to align the magnetic particles and cause the magnetic particle-embedded encapsulant to have anisotropic conductivity;
- and hardening the magnetic particle-embedded encapsulant to hold the magnetic particles in an aligned state.
1 more element
A device comprising:
- a first circuit element;
- a second circuit element;
- and an interconnect between the first circuit element and the second circuit element, the interconnect comprising, a liquid conductive pathway, a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway at one or more terminal regions between the liquid conductive pathway and one or more of the first circuit element and the second circuit element, and an encapsulant that is not embedded with conductively anisotropic magnetic particles positioned in a central region of the liquid conductive pathway.
Dependencies are inferred from the claim text.