Copper clad laminate, printed circuit board including the same, and manufacturing method of the same

A method for manufacturing a copper clad laminate, comprising steps of:

• preparing a first copper foil layer;
• casting and drying a first thermoplastic polyimide precursor resin on the first copper foil layer to form a first thermoplastic polyimide precursor layer;
• casting and drying a polyimide precursor resin on the first thermoplastic polyimide precursor layer to form a polyimide precursor layer;
• casting and drying a second thermoplastic polyimide precursor resin on the polyimide precursor layer to form a second thermoplastic polyimide precursor layer;
• curing, by a heat treatment, the first thermoplastic polyimide precursor layer, the polyimide precursor layer, and the second thermoplastic polyimide precursor layer to form a composite layer;
• and
• stacking a second copper foil layer on the second thermoplastic polyimide layer,
• wherein, a total thickness of the first thermoplastic polyimide layer and a thickness of the second thermoplastic polyimide layer is in a range of from about 15 to about 50% with respect to the total thickness of the composite layer, a total thickness of the polyimide layer is in a range of from about 50 to about 85% with respect to the total thickness of the composite layer,
• each thickness of the first copper foil layer and the second copper foil layer thickness is in a range of from about 30 to about 80 μm, and the total thickness of the composite layer is in a range of from about 40 to about 60 μm, and
• wherein the step forming the first thermoplastic polyimide precursor layer and the step forming the polyimide precursor layer are performed repeatedly 2 times.