Methods of sewing components in fabrics using metal wire cloth
AssigneeFlextronics AP, LLC
InventorsWeifeng Liu, Anwar Mohammed, Zhen Feng
Life of this patent
Estimating the term…
Abstract
An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.
Claims17
An electronics assembly comprising:
- a. a fabric;
- b. an electronic component comprising a plurality of electrical connection points;
- c. a plurality of electrically conductive wire meshes, each wire mesh comprising a plurality of first electrically conductive wires electrically interconnected to form the wire mesh, each electrically conductive wire mesh is coupled to a corresponding one of the plurality of electrical connection points of the electronic component, wherein an electrical connection is formed between each electrically conductive wire mesh and the corresponding one electrical connection point;
- and
- d. a plurality of second electrically conductive wires, each second electrically conductive wire is stitched to the fabric and to a corresponding one of the plurality of electrically conductive wire meshes such that an electrical connection is formed between each second electrically conductive wire and the corresponding one electrically conductive wire mesh.
Dependencies are inferred from the claim text.