LED lighting assemblies with thermal overmolding
AssigneeGE Lighting Solutions, LLC
InventorsJeffrey Nall, Matthew Mrakovich
Life of this patent
Estimating the term…
Abstract
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100 ° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Claims23
A lighting assembly, comprising:
- a printed circuit board;
- one or more light emifting diode (LED) inclusive packages disposed on the printed circuit board;
- conductors electrically connected to the printed circuit board;
- one or more light-transmissive cover disposed over the one or more LED package;
- an overmolding encapsulating a portion of the cover and the printed circuit board over at least portions of the printed circuit board proximate the one or more LED package, said overmolding forming at least one exterior surface of the lighting assembly;
- and
- wherein the overmolding does not cover at least a light output aperture of the LED package and a portion of the cover overlying the LED package.
A lighting assembly, comprising:
- a printed circuit board;
- one or more light emitting diode (LED) inclusive packages disposed on the printed circuit board;
- conductors electrically connected to the printed circuit board;
- one or more light-transmissive cover disposed over the one or more LED package;
- an overmolding encapsulating the printed circuit board over at least portions of the printed circuit board proximate the one or more LED package and without contacting the one or more LED package;
- and
- wherein the overmolding does not cover at least a light output aperture of the LED and a portion of the one or more light-transmissive cover overlying the one or more LED package.
A lighting assembly, comprising:
- a printed circuit board;
- one or more light emitting diodes (LEDs) inclusive packages disposed on the printed circuit board;
- conductors electrically connected to the printed circuit board;
- a light-transmissive cover disposed over the one or more packages, said cover having a base region;
- and
- an overmolding encapsulating a portion of the printed circuit board and contacting at least one exterior surface of the light-transmissive cover only at the base region thereof, and forming an exterior surface of the lighting assembly.
A lighting assembly comprising:
- a printed circuit board;
- a plurality of light emitting diodes (LEDs) inclusive packages disposed on a front surface of the printed circuit board;
- a light-transmissive cover secured to said printed circuit board and overlying said packages;
- and
- an overmolding encapsulating at least a portion of the printed circuit board, said overmolding forming a planar exterior surface of the lighting assembly configured for mounting on a planar substrate, and wherein said light-transmissive over includes an interior surface having at least a portion spaced above said printed circuit board a distance greater than the overmolding adjacent said light-transmissive cover.
Dependencies are inferred from the claim text.