Ultrasonic transducers and methods of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSeogwoo Hong, Dongsik Shim, Seokwhan Chung
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electronics Co., Ltd.
InventorsSeogwoo Hong, Dongsik Shim, Seokwhan Chung
Estimating the term…
An ultrasonic transducer module may comprise: an ultrasonic transducer comprising a substrate, a thin film separated from the substrate, a support portion for supporting the thin film, and a first electrode pad on the substrate; and/or a circuit board comprising a main body, an opening in the main body for accommodating the thin film, and a second electrode pad attached to the first electrode pad. An ultrasonic transducer may comprise: a substrate; a plurality of first electrode layers on the substrate, with spaces between the first electrode layers; an insulating layer between the substrate and the first electrode layers; a support portion on the first electrode layers; a thin film supported by the support portion, with cavities between each of the first electrode layers and the thin film; and/or a second electrode layer on the thin film.
An ultrasonic transducer module, comprising:
An ultrasonic transducer, comprising:
A method of manufacturing an ultrasonic transducer, the method comprising:
Dependencies are inferred from the claim text.