Via density in radio frequency shielding applications
AssigneeSkyworks Solutions, Inc.
InventorsHoward E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
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Abstract
Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.
Claims24
A packaged module comprising:
- a radio frequency component;
- a plurality of vias disposed around the radio frequency component in a layer on a first side of the radio frequency component, vias of the plurality of vias having a higher via density in a hot spot of the packaged module than in a low radiating area of the packaged module;
- a second plurality of vias in a second layer on the first side of the radio frequency component;
- a conductive trace disposed between the first layer and the second layer, the conductive trace electrically connecting the plurality of vias to the second plurality of vias;
- and
- a conductive layer on a second side of the radio frequency component, the second side opposing the first side, the conductive layer being electrically connected to the conductive trace by way of the vias of the plurality of vias such that the conductive layer, the plurality of vias, and the conductive trace form at least a portion of a radio frequency isolation structure around the radio frequency component.
A packaged module comprising:
- a radio frequency component on a substrate;
- a first plurality of vias disposed around the radio frequency component in a first layer of the substrate, vias of the first plurality of vias having a higher via density in a hot spot than in a low radiating area;
- a second plurality of vias in a second layer of the substrate;
- a conductive trace in a third layer of the substrate between the first layer and the second layer, the conductive trace electrically connecting the first plurality of vias to the second plurality of vias;
- and
- a conductive feature around the radio frequency component, the conductive feature being in an electrical path between the first plurality of vias and a conductive layer such that the conductive layer, the conductive feature, the first plurality of vias, and the second plurality of vias together form at least a portion of a radio frequency isolation structure around the radio frequency component.
A packaged module comprising:
- a radio frequency component on a surface of a substrate;
- a plurality of vias disposed around the radio frequency component in a first layer of the substrate, vias of the plurality of vias having a higher via density in a hot spot of the packaged module than in a low radiating area of the packaged module;
- a second plurality of vias in a second layer of the substrate;
- a conductive trace in a third layer of the substrate between the first layer and the second layer, the conductive trace electrically connecting the plurality of vias to the second plurality of vias, the plurality of vias being disposed between the conductive trace and the surface of the substrate;
- a conductive layer, the radio frequency component being disposed between the conductive layer and the surface of the substrate;
- and
- wirebonds disposed around the radio frequency component, the wirebonds being in electrical paths between the plurality of vias and the conductive layer such that the conductive layer, the wirebonds, and the plurality of vias form at least a portion of a radio frequency isolation structure around the radio frequency component.
Dependencies are inferred from the claim text.