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US 9,871,224 B2Granted
Encapsulation film
AssigneeLG Chem, Ltd.
InventorsHyun Suk Kim, Hyun Jee Yoo, Jung Ok Moon, Se Woo Yang
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Abstract
Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Particularly, the encapsulation film, which effectively blocks moisture or oxygen entering the organic electronic device from the outside, and has excellent mechanical properties such as handleability and processability, and the organic electronic device including the same are provided.
Claims12
An encapsulation film for an organic electronic element, comprising:
- a protective layer having a tensile modulus of 0.01 to 500 MPa at 25° C.;
- a metal layer formed on one surface of the protective layer;
- and
- an encapsulation layer formed on the metal layer,
- wherein the protective layer has a thickness of 40 to 400 μm,
- wherein the metal layer has a thickness of 10 to 100 μm, and
- wherein the protective layer and the metal layer satisfy General Equation 1:
- Tp/Tm≧1 [General Equation 1]
- where Tp is a thickness of the protective layer, and Tm is a thickness of the metal layer.
6 more elements
Dependencies are inferred from the claim text.