US 9,871,178 B2Granted

Light-emitting diode device

AssigneeEpistar Corporation

InventorHui-chun Yeh

Life of this patent

Estimating the term…

Loading patent…

Abstract

A light-emitting diode device is disclosed, which comprises a substrate including a first surface; a plurality of light-emitting diode units formed on the first surface, each of the light-emitting diode units including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; and a plurality of conductive connecting structures, spatially separated from each other, wherein one end of one of the plurality of conductive connecting structure is arranged on the second semiconductor layer, directly contacted with the second semiconductor layer, and electrically connected with each other through the second semiconductor layer; wherein another end of the one of the conductive connecting structures is arranged on another light-emitting diode unit, and directly contacted with one of the semiconductor layers of the another light-emitting diode unit.

Claims17

Dependent claims

A light emitting diode device, comprising:

a substrate including a first surface;
a plurality of light-emitting diode units formed on the first surface wherein each of the light-emitting diode units comprises:
a first semiconductor layer;
and
a second semiconductor layer formed on the first semiconductor layer;
and
a first group of conductive connecting structures spatially separated from each other and electrically connecting the plurality of light-emitting diode units, wherein each conductive connecting structure comprises a middle part, a first extending part and a second extending part;
wherein the first extending parts of the first group of conductive connecting structures are arranged on and electrically connected with the second semiconductor layer of a same one of the plurality of light-emitting diode units, and the second extending parts of the first group of conductive connecting structures are arranged on and connected with one of the first and second semiconductor layers of an adjacent light-emitting diode unit of the plurality of light-emitting diode units;
wherein the first and the second extending parts have different length.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/954,465Filed 30 Nov 2015 · division
Priority: TW 101108402 A12 Mar 2012
Published: US 2016/0087181 A124 Mar 2016
Granted: 16 Jan 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
H10H 29/14
Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00: comprising multiple light-emitting…
H10H 29/142
Comprising multiple light-emitting semiconductor components: two-dimensional arrangements, e.g. asymmetric LED layout
H10H 20/831
Electrodes: characterised by their shape

Family

Application13/796,044Parent of this division · filed 12 Mar 2013
US 2016/0087181 A1Pre-grant publication · published 24 Mar 2016
US 9,203,003 B2Parent of this division
US 2013/0234172 A1Published application
US 9,871,178 B2This patent

From the US filing history. Foreign family members aren’t listed.