Anisotropic conductive film (ACF) including a relfective layer
AssigneeTrillion Science, Inc.
InventorsRong-Chang Liang, Jane Sun, Keren Zhang
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Abstract
An anisotropic conductive film (ACF) is disclosed. In one approach, the ACF includes a non-reflective adhesive layer including a top surface, a plurality of conductive particles included with the non-reflective adhesive layer, and a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer. The reflective layer includes at least five percent reflective particles by percentage weight.
Claims27
An anisotropic conductive film (ACF), comprising:
- a non-reflective adhesive layer including a top surface;
- a plurality of conductive particles included with the non-reflective adhesive layer;
- and
- a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer, wherein the reflective layer includes at least five percent reflective particles by percentage weight,
- wherein:
- the ACF is a fixed-array ACF and the conductive particles are arranged in predetermined locations along a bottom surface of the non-reflective adhesive layer;
- and
- the non-reflective adhesive layer includes a concentration of at least 20,000 pcs/mm2 of the conductive particles.
An anisotropic conductive film (ACF), comprising:
- a non-reflective adhesive layer including a top surface;
- a plurality of conductive particles included with the non-reflective adhesive layer;
- and
- a thin film deposited reflective layer disposed along the top surface of the non-reflective adhesive layer, the thin film deposited reflective layer including a second top surface;
- and
- a secondary adhesive layer disposed along the second top surface of the thin film deposited reflective layer,
- wherein:
- the ACF is a fixed-array ACF and the conductive particles are arranged in predetermined locations along a bottom surface of the non-reflective adhesive layer;
- and
- the non-reflective adhesive layer includes a concentration of at least 20,000 pcs/mm2 of the conductive particles.
A light-emitting device, comprising:
- a light-emitting housing including a plurality of light-emitting elements;
- an electrode substrate;
- a plurality of chip bumps disposed between the light-emitting housing and the electrode substrate;
- and
- an anisotropic conductive film (ACF) electrically connecting the light-emitting housing and the electrode substrate, comprising:
- a non-reflective adhesive layer including a top surface;
- a plurality of conductive particles included with the non-reflective adhesive layer;
- and
- a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer, wherein the reflective layer includes at least five percent reflective particles by percentage weight,
- wherein the ACF is a fixed-array ACF and the conductive particles are arranged in predetermined locations along a bottom surface of the non-reflective adhesive layer.
A light-reflecting or transflecting device, comprising:
- a housing;
- an electrode substrate;
- an anisotropic conductive film (ACF) electrically connecting the housing and the electrode substrate, comprising:
- a non-reflective adhesive layer including a top surface;
- a plurality of conductive particles included with the non-reflective adhesive layer;
- and
- a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer, wherein the reflective layer includes at least five percent reflective particles by percentage weight, wherein:
- pre-bonding the ACF was a fixed-array ACF and the conductive particles were arranged in predetermined locations along a bottom surface of the non-reflective adhesive layer;
- and
- the non-reflective adhesive layer includes a concentration of at least 20,000 pcs/mm2 of the conductive particles;
- and
- a plurality of chip bumps in contact with at least a portion of the conductive particles.
Dependencies are inferred from the claim text.