Memory device
AssigneeUnited Microelectronics Corp.
InventorsChun-Hsien Huang, Ching-Cheng Lung, Yu-Tse Kuo, Li-Ping Huang, Chun-Yen Tseng
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AssigneeUnited Microelectronics Corp.
InventorsChun-Hsien Huang, Ching-Cheng Lung, Yu-Tse Kuo, Li-Ping Huang, Chun-Yen Tseng
Estimating the term…
A memory device includes a pickup area extending along a first direction. The pickup area includes at least one N-pickup structure, distributing along an N-pickup line extending at the first direction. At least one P-pickup structure distributes by alternating with the N-pickup structure at the first direction and interleaves with the N-pickup structure at a second direction. The second direction is perpendicular to the first direction. Dummy pickup structure distributes along the first direction, opposite to the P-pickup structure with respect to the N-pickup line. Further, a cell area is beside the pickup area. The SRAM cells in the cell area form cell rows extending along the second direction. Each SRAM cell covers one N-type well region along the second direction and two P-type well regions along the second direction to sandwich the N-type well region. The N-pickup/P-pickup structures respectively provide first/second substrate voltage to the N-type/P-type well regions.
A memory device, having a plurality of static random-access memory (SRAM) cells, and the memory device comprising:
Dependencies are inferred from the claim text.