Semiconductor device

A semiconductor device comprising:

• a substrate including a semiconductor substrate, a buried insulating layer formed over the semiconductor substrate, and a semiconductor layer formed over the buried insulating layer;
• an isolation insulating layer, buried in the semiconductor layer so as to reach the buried insulating layer, which insulates a first circuit forming region of the semiconductor layer from a second circuit forming region thereof;
• a first circuit formed using the first circuit forming region;
• a second circuit formed using the second circuit forming region;
• a first lead, a second lead, a third lead, a fourth lead, and a substrate mounting member, the substrate mounting member comprising a first side, a second side opposite the first side, a third side between the first side and the second side, and a fourth side opposite the third side,
• wherein the substrate mounting member is connected to the semiconductor substrate and is not directly electrically connected to the first lead and the second lead,
• wherein the first lead comprises one end and another end opposite the one end,
• wherein the second lead comprises one end and another end opposite the one end,
• wherein the third lead comprises one end and another end opposite the one end, and
• wherein the fourth lead comprises one end and another end opposite the one end;
• a first electrode pad which is connected to the first circuit forming region and the first lead;
• a second electrode pad which is connected to the second circuit forming region and the second lead;
• and
• a sealing resin that seals the substrate, the first lead, the second lead, the third lead, the fourth lead, and the substrate mounting member, the sealing resin comprising a first side surface, a second side surface opposite the first side surface, a third side surface between the first side surface and the second side surface, and a fourth side surface opposite the third side surface, wherein the first side, the second side, the third side, and the fourth side of the substrate mounting member face the first side surface, the second side surface, the third surface, and the fourth side surface of the sealing resin, respectively,
• wherein the semiconductor substrate is not directly electrically connected to the first electrode pad and the second electrode pad,
• wherein the one end of the first lead faces the first side of the substrate mounting member and the another end of the first lead is exposed from the first side surface of the sealing resin,
• wherein the one end of the second lead faces the second side of the substrate mounting member and the another end of the second lead is exposed from the second side surface of the sealing resin,
• wherein the one end of the third lead is connected to a corner between the first side and the third side of the substrate mounting member and the another end of the third lead is in contact with a corner between the first side surface and the third side surface of the sealing resin without extending outwardly from the corner between the first side surface and the third side surface of the sealing resin, and
• wherein the one end of the fourth lead is connected to one of the third side and the fourth side of the substrate mounting member and the another end of the fourth lead is exposed from one of the third side surface and the fourth side surface of the sealing resin, wherein the one of the third side and the fourth side of the substrate mounting member faces the one of the third side surface and the fourth side surface of the sealing resin.