Method for transfer of semiconductor devices

A method for transferring semiconductor devices to a product substrate, the method comprising:

• providing a transfer mechanism including a pin and an actuator configured to cause the pin to thrust reciprocatively, and a fixing device configured to emit energy to affix the semiconductor devices to the product substrate;
• positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and positioning the semiconductor wafer and the product substrate in a transfer position with respect to the transfer mechanism;
• actuating the actuator of the transfer mechanism to cause the pin to engage a second surface of the semiconductor wafer, the second surface of the semiconductor wafer being opposite the first surface of the semiconductor wafer, and the actuating the transfer mechanism including causing the pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position;
• detaching the particular semiconductor device from the second surface of the semiconductor wafer;
• and
• attaching the particular semiconductor device to the product substrate by applying energy directly on the product substrate during a transfer operation via the fixing device.