Data storage device having multi-stack chip package and operating method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung-seop Shim, Jaehong Kim
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Abstract
Disclosed is a data storage device including a controller and a multi-stack chip package, and a method of operating a data storage device. The multi-stack chip package includes a first semiconductor chip arranged on a package substrate, a second semiconductor chip arranged on the first semiconductor chip, and a third semiconductor chip is arranged between the first and second semiconductor chips. The controller can control the first to third semiconductor chips by using a feature parameter measured from each semiconductor chip and a target value that may be originally designed by a memory vendor.
Claims20
A data storage device comprising:
- a multi-stack chip package comprising a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip, wherein the first semiconductor chip is arranged on a package substrate and has a first measured feature parameter value for a particular feature parameter, the second semiconductor chip is arranged on the first semiconductor chip and has a second measured feature parameter value for the particular feature parameter, and the third semiconductor chip is arranged between the first and second semiconductor chips and has a third measured feature parameter value for the particular feature parameter;
- and
- a controller configured to control the first to third semiconductor chips by using the first measured feature parameter value and a target value, for the first semiconductor chip, using the second measured feature parameter value and the target value, for the second semiconductor chip, and using the third measured feature parameter value and the target value, for the third semiconductor chip,
- wherein a difference between the first measured feature parameter value and the target value (“first feature difference”) is greater than a difference between the third measured feature parameter value and the target value (“third feature difference”), and a difference between the second measured feature parameter value and the target value (“second feature difference”) is greater than the third feature difference.
A method of controlling a data storage device which comprises a multi-stack chip package comprising a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip, wherein the first semiconductor chip is arranged on a package substrate and has a first feature parameter, the second semiconductor chip is arranged on the first semiconductor chip and has a second feature parameter, and the third semiconductor chip is arranged between the first and second semiconductor chips and has a third feature parameter, the method comprising:
- measuring values of the first, second, and third feature parameters from the first, second, and third semiconductor chips, respectively;
- storing the values of the first to third feature parameters in the first to third semiconductor chips, respectively;
- reading the values of the first to third stored feature parameter values when the data storage device is booted on;
- and
- controlling the first to third semiconductor chips by using a difference (hereinafter referred to as a “first feature difference”) between the first feature parameter value and a target value, a difference (hereinafter referred to as a “second feature difference”) between the second feature parameter value and the target value, and a difference (hereinafter referred to as a “third feature difference”) between the third feature parameter value and the target value,
- wherein the first feature difference is greater than the third feature difference and the second feature difference is greater than the third feature difference.
A multi-stack chip package comprising:
- a first semiconductor chip arranged on a package substrate and having a first measured feature parameter value for a particular feature parameter;
- a second semiconductor chip arranged on the first semiconductor chip and having a second measured feature parameter value for the particular feature parameter;
- and
- a third semiconductor chip arranged between the first and second semiconductor chips and having a third measured feature parameter value for the particular feature parameter,
- wherein the first to third semiconductor chips are controlled based on a difference (hereinafter referred to as a “first feature difference”) between the first measured feature parameter and a target value, a difference (hereinafter referred to as a “second feature difference”) between the second measured feature parameter and the target value, and a difference (hereinafter referred to as a “third feature difference”) between the third measured feature parameter and the target value, and
- wherein the first feature difference is greater than the third feature difference and the second feature difference is greater than the third feature difference.
Dependencies are inferred from the claim text.