Packaged semiconductor devices and methods of packaging semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng
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Abstract
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a mask coating over a carrier, coupling an integrated circuit die over the mask coating, and disposing a molding compound around the integrated circuit die. The method includes forming an interconnect structure over the integrated circuit die and the molding compound.
Claims20
A packaged semiconductor device, comprising:
- an integrated circuit die;
- an adhesive film on a first side of the integrated circuit die;
- a molding compound disposed around the integrated circuit die;
- a mask coating disposed over the first side of the integrated circuit die and the molding compound, the mask coating being in physically contact with the adhesive film;
- and
- an interconnect structure disposed over a second side of the integrated circuit die and the molding compound, wherein the second side is opposite the first side.
A package-on-package (PoP) device, comprising:
- a mask coating;
- one or more integrated circuit (IC) dies on the mask coating;
- an adhesive film interposed between the mask coating and the one or more IC dies;
- a first molding compound at least partially encapsulating the one or more IC dies and contacting the mask coating;
- an interconnect structure over the one or more IC dies and the first molding compound;
- and
- a second semiconductor device coupled to a plurality of contact pads disposed over or within the mask coating.
A device, comprising:
- an integrated circuit (IC) die at least partially encapsulated by a molding compound;
- an adhesive film on a first side of the IC die;
- a mask coating overlying the first side of the IC die and the molding compound, wherein the mask coating is in physical contact with the adhesive film, wherein the mask coating comprises a functional group of a material selected from the group consisting essentially of methylolpmpanel hmylate, 2-hydroxyethyl methacrylate, and combinations thereof;
- an interconnect structure electrically connected to contact pads on a second side of the IC die, the second side being opposite the first side;
- and
- a connector structure electrically connected to the interconnect structure.
Dependencies are inferred from the claim text.