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US 9,871,016 B2Granted
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorLiqun Gu
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor package including a substrate; at least one semiconductor chip mounted on the substrate; a molding element, which is arranged on the substrate and encapsulates the at least one semiconductor chip; and a lattice element, which is arranged inside the molding element, where the lattice element includes a body having a plurality of openings.
Claims18
A semiconductor package comprising:
- a substrate;
- at least one semiconductor chip mounted on the substrate;
- a molding element encapsulating the at least one semiconductor chip;
- and
- a lattice element arranged inside the molding element,
- wherein the lattice element comprises a body, a plurality of openings defined by the body and a plurality of supports extending from the substrate to the body,
- wherein the body of the lattice element is stacked vertically on the at least one semiconductor chip,
- wherein the plurality of supports are separated from each other, and
- wherein one of the plurality of supports is disposed between two adjacent openings of the plurality of openings in a plane view.
6 more elements
A semiconductor package comprising:
- a substrate;
- a plurality of semiconductor chips mounted on the substrate;
- a molding element encapsulating the plurality of semiconductor chips;
- and
- a lattice element arranged inside the molding element,
- wherein the lattice element comprises:
- a first body, a plurality of first openings defined by the first body, and a plurality of first supports extending from the first body to the substrate;
- and
- a second body, a plurality of second openings defined by the second body, and a plurality of second supports extending from the second body to the first body,
- wherein the first body and the second body are stacked vertically on the plurality of semiconductor chips, and
- wherein the first body is interposed between the second body and the plurality of semiconductor chips.
8 more elements
A semiconductor package comprising:
- a substrate;
- at least one semiconductor chip mounted on the substrate;
- a molding element encapsulating the at least one semiconductor chip;
- and
- a plurality of plates comprising a first plate and a second plate, each of the plurality of plates having a plurality of openings extending therethrough being disposed inside the molding element, the plurality of plates overlying the at least one semiconductor chip;
- and
- a plurality of first supports extending between the substrate the first plate;
- and
- a plurality of second supports extending between the first plate and the second plate,
- wherein the first plate and the second plate are stacked vertically on the at least one semiconductor chip, and
- wherein the first plate is interposed between the second plate and the at least one semiconductor chip.
8 more elements
Dependencies are inferred from the claim text.