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US 9,871,013 B2Granted
Contact area design for solder bonding
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang, Sheng-Yu Wu
Life of this patent
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Abstract
A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region.
Claims20
A package comprising:
- a first package component comprising:
- a first dielectric layer;
- a second dielectric layer over and contacting the first dielectric layer;
- a metal pad over the first dielectric layer, wherein the metal pad is in the second dielectric layer;
- and
- a first plurality of openings in the metal pad, wherein the first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region;
- a solder region in contact with the metal pad, wherein an outer edge of the solder region is in contact with a sidewall of the second dielectric layer;
- and
- a metal trace in the first dielectric layer, the metal trace comprising a second plurality of openings filled with a dielectric material.
6 more elements
A package comprising:
- a first package component comprising:
- a metal trace;
- and
- a metal pad over the metal trace, wherein the metal pad comprises a plurality of discrete portions physically separated from each other, wherein the plurality of discrete portions is electrically coupled to each other through the metal trace.
1 more element
A package comprising:
- a first package component comprising:
- a metal trace comprising a trace portion and a pad portion connected to the trace portion, wherein the pad portion is wider than the trace portion in a top view of the first package component;
- a metal pad overlapping and in contact with the pad portion, wherein the trace portion and the pad portion are in a same metal layer, and the trace portion of the metal trace extends beyond edges of the metal pad in a plan view;
- and
- a first plurality of openings in the metal pad, wherein the first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region, the first plurality of openings being wider at a region more distal from the metal trace than at a region more proximate to the metal trace;
- a second package component;
- and
- a solder region bonding the second package component to the metal pad.
5 more elements
Dependencies are inferred from the claim text.