Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant

A tin-based electroplating solution, comprising:

• tin methanesulfonate in such an amount that the tin content of the plating solution is from 40 to 105 g/L;
• silver methanesulfonate, as an optional component, in such an amount that the silver content of the plating solution is from 0.40 to 3.0 g/L;
• 70 to 210 g/L of methanesulfonic acid;
• 0.01 to 100 mg/L of a fluorinated surfactant;
• 0.5 to 60 g/L of an aromatic polyoxyalkylene ether;
• and water
• wherein the fluorinated surfactant contains alkali perfluoroalkyl phosphate species of 1-I and 1-II represented by Formula 1 and water,
• wherein each n is an integer from 5 to 11 and each M is at least one alkali metal selected from the group consisting of sodium, potassium, and wherein the surfactant composition is in the form of a solid and the water content is from 0.1 to 3.0% by weight.