Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsI-Chia Lin, Chieh-Chen Fu, Kuo Hsien Liao, Cheng-Nan Lin
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Abstract
A semiconductor device package includes a carrier, an electronic component disposed over a top surface of the carrier, and a package body disposed over the top surface of the carrier and covering the electronic component. The semiconductor device package further includes a shield layer, which in turn includes a first electrically conductive layer, a first magnetically permeable layer, and a second electrically conductive layer, where the first magnetically permeable layer is interposed between and directly contacts the first electrically conductive layer and the second electrically conductive layer.
Claims22
A semiconductor device package, comprising:
- a carrier;
- an electronic component disposed over a top surface of the carrier;
- a package body disposed over the top surface of the carrier and covering the electronic component;
- and
- a shield layer, comprising a first electrically conductive layer, a first magnetically permeable layer, and a second electrically conductive layer;
- wherein the first magnetically permeable layer is interposed between and directly contacts the first electrically conductive layer and the second electrically conductive layer, and a permeability of the first magnetically permeable layer is higher than each of a permeability of the first electrically conductive layer and a permeability of the second electrically conductive layer.
A semiconductor device package, comprising:
- a carrier;
- an electronic component disposed over a top surface of the carrier;
- a package body disposed over the top surface of the carrier and covering the electronic component;
- and
- a shield layer, comprising
- a first electrically conductive layer disposed over the package body;
- and
- a first magnetically permeable layer disposed over the first electrically conductive layer;
- wherein a ratio of a thickness of the first electrically conductive layer to a thickness of the first magnetically permeable layer ranges from about 30:1 to about 400:1.
Dependencies are inferred from the claim text.