Laminates of integrated electromagnetically shieldable thin inductors, capacitors, and semiconductor chips
AssigneeSuzhou Qing Xin Fang Electronics Technology Co., Ltd.
InventorJerry Zhijun Zhai
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Abstract
Semiconductor chip laminates and inductive, capacitive, and electromagnetic shielding laminate structures that can be integrated together to form electronic circuits for use in systems and devices such as smartphones, tablet computers, notebook computers, wearable electronic devices, portable medical devices, servers, networking equipment, industrial equipment, etc. Fabrications of such integrated laminate structures can be modularized into four (4) types of laminates, namely, inductive laminates, capacitive laminates, electromagnetic shielding laminates, and semiconductor chip laminates, which can be vertically laminated together and/or integrated side-by-side with high density to produce the desired electronic circuits, systems, and devices.
Claims27
An integrated laminate structure for use in an electronic system or device, comprising:
- a plurality of modular laminate structures including a modular inductive laminate structure, and one or more of a modular capacitive laminate structure, a modular semiconductor chip laminate structure, and a modular electromagnetic shielding laminate structure,
- wherein the modular inductive laminate structure includes a first coil conductor layer, a first insulation layer vertically laminated on the first coil conductor layer, a magnetic core sheet layer vertically laminated on the first insulation layer, a second insulation layer vertically laminated on the magnetic core sheet layer, and a second coil conductor layer vertically laminated on the second insulation layer, the first coil conductor layer including a first plurality of etched coil conductor portions, and the second coil conductor layer including a second plurality of etched coil conductor portions,
- wherein the modular inductive laminate structure further includes a plurality of vias formed through the magnetic core sheet layer to interconnect the first coil conductor layer and the second coil conductor layer, the first and second pluralities of etched coil conductor portions in combination with the plurality of vias forming multiple turns of one or more coil windings wrapped around the magnetic core sheet layer,
- wherein one or more of the plurality of vias include a first hole extending through the magnetic core sheet layer from the first coil conductor layer to the second coil conductor layer, an insulative material disposed within the first hole, and a second hole smaller than the first hole formed through the insulative material from the first coil conductor layer to the second coil conductor layer, the second hole having an electroplated sidewall, and
- wherein the plurality of modular laminate structures are vertically laminated together to form at least part of at least one electronic circuit within the electronic system or device.
An integrated laminate structure for use in an electronic system or device, comprising:
- a plurality of modular laminate structures including a modular inductive laminate structure, and one or more of a modular capacitive laminate structure, a modular semiconductor chip laminate structure, and a modular electromagnetic shielding laminate structure,
- wherein the modular inductive laminate structure includes a first coil conductor layer, a first insulation layer vertically laminated on the first coil conductor layer, a first magnetic core sheet layer vertically laminated on the first insulation layer, a second insulation layer vertically laminated on the first magnetic core sheet layer, a second magnetic core sheet layer vertically laminated on the second insulation layer, a third insulation layer vertically laminated on the second magnetic core sheet layer, and a second coil conductor layer vertically laminated on the third insulation layer, and
- wherein the plurality of modular laminate structures are vertically laminated together to form at least part of at least one electronic circuit within the electronic system or device.
Dependencies are inferred from the claim text.