Feeding overlay data of one layer to next layer for manufacturing integrated circuit
AssigneeUnited Microelectronics Corp.
InventorEn-Chiuan Liou
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an integrated circuit includes the following steps. A substrate including a plurality of exposure fields is provided, and each of the exposure fields includes a target portion and a set of overlay marks. The substrate is exposed to form a first layer lithography pattern on the target portion for the respective exposure field by an exposure system. The overlay of the first layer lithography pattern and the target portion is measured by the set of overlay marks of each exposure field to obtain first overlay data for the respective exposure field by a measuring system. The first overlay data is fed to form a second layer lithography pattern.
Claims17
A method of manufacturing an integrated circuit, comprising:
- providing a substrate comprising a plurality of exposure fields, and each of the exposure fields comprising a target portion and a set of overlay marks;
- exposing the substrate to form a first layer lithography pattern on the target portion for the respective exposure field by an exposure system;
- measuring an overlay of the first layer lithography pattern and the target portion by the set of overlay marks of each exposure field to obtain first overlay data for the respective exposure field by a measuring system;
- and
- feeding the first overlay data to form a second layer lithography pattern with different weightings in different directions by the measuring system, wherein the first layer lithography pattern and the second layer lithography pattern are formed in different layers.
Dependencies are inferred from the claim text.