Integrated fan-out package and method of fabricating the same

A method for fabricating an chip package, comprising:

• transferring a plurality of conductive posts placed in respective apertures of a substrate to an adhesive formed on a carrier in a standing orientation;
• disposing an integrated circuit component onto the adhesive having the plurality of conductive posts disposed thereon;
• encapsulating the integrated circuit component and the plurality of conductive posts with an insulating encapsulation;
• forming a redistribution circuit structure electrically connected to the integrated circuit component and the plurality of conductive posts on the insulating encapsulation, the integrated circuit component and the plurality of conductive posts;
• and
• removing the carrier.

A method for fabricating an chip package, comprising:

• placing a plurality of conductive posts in respective apertures of a substrate;
• providing a carrier having an adhesive thereon;
• adhering the adhesive with the plurality of conductive posts placed in respective apertures of a substrate;
• pulling out the plurality of conductive posts from the respective apertures of the substrate, wherein the plurality of conductive posts are adhered on the adhesive in a standing orientation;
• disposing an integrated circuit component onto the adhesive having the plurality of conductive posts disposed thereon;
• forming an insulating encapsulation to encapsulate the integrated circuit component and the plurality of conductive posts;
• forming a redistribution circuit structure on the insulating encapsulation, the integrated circuit component, and the plurality of conductive posts, and the redistribution circuit structure being electrically connected to the integrated circuit component and the plurality of conductive posts;
• and
• removing the carrier.