Back to results
US 9,870,985 B1Granted
Semiconductor package with clip alignment notch
AssigneeAmkor Technology, Inc.
InventorMarc Alan Mangrum
Life of this patent
Estimating the term…
Abstract
An electronic component includes a leadframe and a first semiconductor die. The leadframe includes a leadframe top side, a leadframe bottom side opposite the leadframe top side, and a top notch at the leadframe top side. The top notch includes a top notch base located between the leadframe top side and the leadframe bottom side, and defining a notch length of the top notch, and can also include a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base. The first semiconductor die can include a die top side a die bottom side opposite the die top side and mounted onto the leadframe top side, and a die perimeter. The top notch can be located outside the die perimeter. Other examples and related methods are also disclosed.
Claims22
An electronic component comprising:
- a leadframe top plane;
- a leadframe bottom plane parallel to the leadframe top plane;
- a leadframe comprising:
- a leadframe top side comprising:
- a leadframe top end, along which the leadframe top plane extends;
- a leadframe bottom side comprising:
- a leadframe bottom end, along which the leadframe bottom plane extends;
- and
- a top notch comprising:
- a top notch base located between the leadframe top plane and the leadframe bottom plane, and defining a notch length of the top notch;
- and
- a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base;
- a first semiconductor die comprising:
- a die top side;
- a die bottom side mounted on the leadframe top side;
- and
- die sidewalls, located between the die top side and the die bottom side, and defining a die perimeter;
- wherein the top notch is located outside the die perimeter,
- a clip comprising:
- a clip tail having a clip edge inserted into the top notch such that a bottom of the clip edge is beneath the leadframe top side;
- and
- a clip roof coupled to the clip tail;
- wherein:
- the clip roof is attached to the first semiconductor die;
- the clip tail protrudes from the top notch past the leadframe top side;
- the bottom of the clip edge adjoins the top notch first sidewall at an angle;
- and
- a depth of the top notch base relative to the leadframe top side prevents the bottom of the clip edge from direct contact with the top notch base.
25 more elements
An electronic component comprising:
- a leadframe comprising:
- a leadframe top side;
- a leadframe bottom side opposite the leadframe top side;
- and
- a top notch at the leadframe top side and comprising:
- a top notch base located between the leadframe top side and the leadframe bottom side, and defining a notch length of the top notch;
- and
- a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base;
- and
- a first semiconductor die comprising:
- a die top side;
- a die bottom side opposite the die top side and mounted onto the leadframe top side;
- and
- die sidewalls, located between the die top side and the die bottom side, and defining a die perimeter;
- wherein the top notch is located outside the die perimeter;
- and
- a clip comprising:
- a clip tail having a clip edge inserted into the top notch such that a bottom of the clip edge is beneath the leadframe top side;
- wherein:
- the clip tail protrudes from the top notch past the leadframe top side;
- the bottom of the clip edge adjoins the top notch first sidewall at an angle;
- and
- a depth of the top notch base relative to the leadframe top side prevents the bottom of the clip edge from direct contact with the top notch base.
20 more elements
An electronic component comprising:
- a leadframe comprising:
- a leadframe top side;
- a leadframe bottom side opposite the leadframe top side;
- and
- a top notch at the leadframe top side and comprising:
- a top notch base located between the leadframe top side and the leadframe bottom side, and defining a notch length of the top notch;
- and
- a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base;
- and
- a first semiconductor die comprising:
- a die top side;
- a die bottom side opposite the die top side and mounted onto the leadframe top side;
- and
- die sidewalls, located between the die top side and the die bottom side, and defining a die perimeter;
- wherein:
- the top notch is located outside the die perimeter;
- and
- the leadframe comprises a lead having:
- a first lead leg having a first leg inner end defining a first section of the top notch first sidewall;
- and
- a second lead leg having a second leg inner end defining a second section of the top notch first sidewall.
18 more elements
An electronic component comprising:
- a leadframe comprising:
- a leadframe top side comprising:
- a leadframe top end, along which a leadframe top plane extends;
- a leadframe bottom side comprising:
- a leadframe bottom end, along which the leadframe bottom plane extends;
- and
- a top notch comprising:
- a top notch base located between the leadframe top plane and the leadframe bottom plane, and defining a notch length of the top notch;
- a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base;
- a notch second sidewall opposite, across the top notch base, to the notch first sidewall;
- and
- a semiconductor die mounted atop the leadframe top side, wherein the semiconductor die comprises:
- a die top side;
- a die bottom side mounted atop the leadframe top side;
- and
- die sidewalls, located between the die top side and the die bottom side, and defining a die perimeter;
- a clip coupled from the top notch to the die top side of the semiconductor die, wherein:
- the top notch is disposed laterally outside of the die perimeter;
- the clip comprises a clip edge inserted into the top notch;
- and
- the clip protrudes from the top notch, past the leadframe top side, to the die top side;
- a fusing structure extending between the bottom of the clip edge and the top notch base, wherein:
- the fusing structure fuses the clip edge in the top notch;
- and
- the fusing structure extends to physically contact the notch second sidewall;
- and
- an encapsulant disposed to encapsulate at least portions of the semiconductor die, at least portions of the clip, and at least portions of the leadframe top side.
24 more elements
Dependencies are inferred from the claim text.