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US 9,870,977 B2Granted
Semiconductor device with heat information mark
AssigneeSamsung Electronics Co., Ltd.
InventorYoung-Deuk Kim
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor package and a mark. The semiconductor package includes a semiconductor chip including a hot spot from which heat is generated, and a mold layer encapsulating the semiconductor chip. The mark is disposed on the semiconductor package. The mark is formed in a region of the semiconductor package that corresponds to a position of the hot spot.
Claims16
A semiconductor device, comprising:
- a semiconductor package, comprising:
- a semiconductor chip comprising a hot spot from which heat is generated;
- and
- a mold layer encapsulating the semiconductor chip;
- a mark disposed on the semiconductor package, wherein the mark is formed in a region of the semiconductor package that corresponds to a position of the hot spot;
- a heat dissipation layer attached to a top surface of the semiconductor package, wherein the heat dissipation layer is disposed on and overlaps the mark;
- and a heat dissipation plate disposed on the mold layer, wherein the heat dissipation plate comprises an expanding portion protruding from the heat dissipation plate, and the mark comprises the expanding portion.
4 more elements
A semiconductor device, comprising:
- a semiconductor package, comprising:
- a semiconductor chip comprising a hot spot from which heat is generated;
- a mold layer encapsulating the semiconductor chip;
- and
- a heat dissipation plate disposed on the mold layer;
- a set assembly assembled with the semiconductor package;
- and
- a mark disposed on a surface of the semiconductor package, wherein the surface of the semiconductor package faces the set assembly, and the mark is formed in a region of the semiconductor package that corresponds to a position of the hot spot,
- wherein the heat dissipation plate comprises an expanding portion protruding from the heat dissipation plate, and the mark comprises the expanding portion.
6 more elements
Dependencies are inferred from the claim text.