US 9,870,976 B2Granted

Method of manufacture for a semiconductor device

AssigneeQorvo US, Inc.

InventorsJulio C. Costa, David M. Shuttleworth, Michael J. Antonell

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Abstract

A method of manufacture for a semiconductor device is disclosed. The method includes providing a semiconductor stack structure that includes a device terminal of a semiconductor device, and having a first surface and a buried oxide (BOX) layer attached to a wafer handle. Another step includes disposing a polymeric layer that includes a polymer and an admixture that increases thermal conductivity of the polymer onto the first surface of the semiconductor stack structure. Another step involves removing the wafer handle from the BOX layer to expose a second surface of the semiconductor stack structure, and yet another step involves removing a portion of the semiconductor stack structure to expose the device terminal.

Claims20

Dependent claims

A method of manufacture for a semiconductor device comprising:

providing a semiconductor stack structure including at least one device terminal of the semiconductor device, and having a first surface and a buried oxide (BOX) layer that is directly attached to a wafer handle;
disposing a polymeric layer that comprises a polymer and an admixture that increases thermal conductivity of the polymer onto the first surface of the semiconductor stack structure;
removing the wafer handle from the BOX layer to completely expose a second surface of the semiconductor stack structure, wherein the second surface is an external surface of the BOX layer that is on an opposite side of the semiconductor stack structure from the first surface;
and
removing a portion of the semiconductor stack structure to expose the at least one device terminal.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/293,947Filed 14 Oct 2016 · division
Priority: 31 Oct 2013
Published: US 2017/0032957 A12 Feb 2017
Granted: 16 Jan 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

Family

Application61/898,009Us provisional application · filed 31 Oct 2013
Application14/529,870Parent of this division · filed 31 Oct 2014
US 2017/0032957 A1Pre-grant publication · published 2 Feb 2017
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From the US filing history. Foreign family members aren’t listed.