Cooling device and device
AssigneeNEC Corporation
InventorTomoyuki Mitsui
Life of this patent
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Abstract
Heat dissipaters 120a, 120b are thermally coupled to a memory 220 and a CPU 230 (heat generating components) disposed on a top surface (a first surface) of a substrate 210. A frame 130 is thermally conductive and is attached above the top surface of the substrate 210. Openings 131 are formed in locations corresponding to locations in the frame 130 where the heat dissipaters 120a, 120b are provided. Elastic rubber elements 150 are thermally conductive and flexible, and thermally couple the heat dissipaters 120a, 120b to the frame 130. This configuration is capable of dissipating heat generated by the heat generating components even when the heat generating components generate amounts of heat that exceed the heat dissipation ability of the heat dissipaters thermally coupled to the heat generating components.
Claims9
A cooling device for at least one heat generating component mounted on a first surface of a substrate, comprising:
- a plurality of heat dissipaters thermally coupled to the heat generating component;
- a frame which is thermally conductive and includes a plurality of openings in which the plurality of heat dissipaters are disposed;
- and
- a connecting element which is thermally conductive and flexible and thermally couples each of the plurality of heat dissipaters to the frame.
A device, comprising:
- a substrate having a first surface;
- a plurality of heat generating components mounted on the first surface of the substrate;
- a plurality of heat dissipaters thermally coupled to the heat generating components;
- a frame which is thermally conductive and includes a plurality of openings in which the plurality of heat dissipaters are disposed;
- and
- a connecting element which is thermally conductive and flexible and thermally couples each of the plurality of heat dissipaters to the frame.
Dependencies are inferred from the claim text.