Thermosetting resin molded article
AssigneeFuji Electric Co., Ltd.
InventorMiki Isono
Life of this patent
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Abstract
A thermosetting resin molded article including: a metal member; a first thermosetting resin layer containing a chelating agent in an amount of 0.5% by mass or more; and a second thermosetting resin layer containing no chelating agent or containing a chelating agent in an amount of less than 0.5% by mass, in which the metal member, the first thermosetting resin layer, and the second thermosetting resin layer are stacked in this order is provided. A semiconductor device including: a semiconductor element mounted on a substrate and metal members, which are sealed with a sealant, in which the sealant includes: a first thermosetting resin layer stacked on the semiconductor element and the metal member; and a second thermosetting resin layer stacked on the first thermosetting resin layer is also provided.
Claims17
A thermosetting resin molded article comprising:
- a first thermosetting resin layer containing a first chelating agent in an amount of 0.5% by mass or more;
- and
- a second thermosetting resin layer containing no chelating agent or containing a second chelating agent in an amount of less than 0.5% by mass,
- wherein the first thermosetting resin layer is stacked on a metal member and the second thermosetting resin layer is stacked on the first thermosetting resin layer.
A semiconductor device comprising:
- a semiconductor element mounted on a substrate, and a metal member, which are sealed with a sealant, wherein the sealant includes:
- a first thermosetting resin layer stacked on the semiconductor element and the metal member, wherein the first thermosetting resin layer contains a first chelating agent in an amount of 0.5% by mass or more;
- and
- a second thermosetting resin layer stacked on the first thermosetting resin layer, wherein the second thermosetting resin layer contains no chelating agent or a second chelating agent in an amount of less than 0.5% by mass.
A method of fabricating a thermosetting resin molded article comprising:
- stacking a first thermosetting resin layer containing a first chelating agent in an amount of 0.5% by mass or more on a metal member;
- and
- stacking a second thermosetting resin layer containing no chelating agent or containing a second chelating agent in an amount of less than 0.5% by mass on the first thermosetting resin layer.
Dependencies are inferred from the claim text.