Repackaged integrated circuit and assembly method
AssigneeGlobal Circuit Innovations Inc.
InventorsErick Merle Spory, Timothy Mark Barry
Life of this patent
Estimating the term…
Abstract
A packaged integrated circuit for operating reliably at elevated temperatures is provided. The packaged integrated circuit includes a reconditioned die, which includes a fully functional semiconductor die that has been previously extracted from a different packaged integrated circuit. The packaged integrated circuit also includes a hermetic package comprising a base and a lid and a plurality of bond wires. The reconditioned die is placed into a cavity in the base. After the reconditioned die is placed into the cavity, the plurality of bond wires are bonded between pads of the reconditioned die and package leads of the hermetic package base or downbonds. After bonding the plurality of bond wires, the lid is sealed to the base.
Claims12
A packaged integrated circuit, comprising:
- a reconditioned die, comprising:
- a modified extracted die with reconditioned die pads, the modified extracted die comprising an extracted die with no ball bonds on die pads of the extracted die, the extracted die comprising a fully functional semiconductor die with one or more ball bonds on one or more die pads, the reconditioned die pads comprising layers of nickel, palladium, and gold over the die pads;
- a package comprising package leads and configured to enclose the reconditioned die;
- and
- a plurality of bond wires, bonded between the reconditioned die pads and the package leads or downbonds.
A packaged integrated circuit, comprising:
- a reconditioned die, comprising:
- a modified extracted die with reconditioned die pads, the modified extracted die comprising an extracted die with no ball bonds on die pads of the extracted die, the extracted die comprising a fully functional semiconductor die with one or more ball bonds on one or more die pads, the reconditioned die pads comprising layers of nickel, palladium, and gold over the die pads in the following sequence:
- the nickel layer in direct contact with the die pads;
- the palladium layer between the nickel and gold layers;
- and
- the gold layer over the palladium layer;
- a hermetic package comprising package leads;
- and
- a plurality of bond wires, bonded between the reconditioned die pads and the package leads or downbonds.
Dependencies are inferred from the claim text.