Plurality of seals for integrated device package
AssigneeAnalog Devices, Inc.
InventorsDavid Bolognia, Jingwen Zhu
Life of this patent
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Abstract
Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a substrate, a wall attached to the substrate, a first adhesive layer disposed between a bottom surface of the wall and a top surface of the substrate, and a second adhesive layer disposed around an outer perimeter of the first adhesive layer, the second adhesive layer disposed adjacent and contacting the wall, the second adhesive layer different from the first adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer connects the wall to electrical ground.
Claims19
A semiconductor package comprising:
- a substrate;
- a wall attached to the substrate;
- a first electrically conductive adhesive layer comprising a first epoxy comprising a conductive filler disposed between a bottom surface of the wall and a top surface of the substrate;
- and
- a second adhesive layer comprising a second epoxy different from the first epoxy, the second epoxy disposed around an outer perimeter of the first adhesive layer, the second adhesive layer disposed adjacent and contacting the wall, the second adhesive layer comprising a material that is different from the first adhesive layer,
- wherein at least one of the first adhesive layer and the second adhesive layer connects the wall to electrical ground by way of connection to one or more ground bond pads on the substrate.
A semiconductor package comprising:
- a substrate;
- a wall attached to the substrate;
- a first epoxy layer disposed between a bottom surface of the wall and a top surface of the substrate;
- and
- a second epoxy layer disposed around an outer perimeter of the first epoxy layer, the second epoxy layer disposed adjacent and contacting the wall,
- wherein the first epoxy layer comprises an epoxy comprising a material different from the second epoxy layer, the first epoxy layer comprising a conductive filler.
A semiconductor package comprising:
- a substrate;
- a wall attached to the substrate;
- an epoxy layer disposed between a bottom surface of the wall and a top surface of the substrate, the epoxy comprising a conductive filler;
- and
- a solder layer disposed around an outer perimeter of the epoxy layer, the solder layer disposed adjacent and contacting the wall,
- a solder mask dam positioned on the substrate proximate the wall,
- wherein the epoxy or solder layer connects the wall to electrical ground by way of connection to one or more ground bond pads on the substrate,
- wherein a portion of the epoxy and solder layer is adhered to the solder mask dam, wherein the solder mask dam comprises a first portion adjacent a second portion, the first and second portions separated by a gap,
- wherein the gap exposes a portion of the substrate, and
- wherein the epoxy or solder layer is electrically grounded via connection to one or more ground bond pads comprising conductive traces of the substrate exposed in the gap.
Dependencies are inferred from the claim text.