Method and apparatus for testing a flip-chip assembly during manufacture

A flip-chip assembly, the flip chip assembly made by a process comprising electrical testing during its manufacture, by a method comprising:

• providing an integrated circuit (IC) die with a surface having interconnection bumps;
• providing an IC package substrate with package pads on a first surface for attachment to the interconnection bumps of the IC die and package bumps on a second surface;
• positioning the IC package substrate on a substrate part holder such that the package bumps are facing, aligned with and in conductive contact with test socket pads on a surface of the substrate part holder, wherein the substrate part holder includes one or more heating elements;
• positioning the IC die on the IC package substrate such that the interconnection bumps are facing, aligned with and in direct conductive contact with the package pads of the IC package substrate, the positioned IC die and IC package substrate forming the flip-chip assembly comprising the IC die in conductive contact with the package pads of the IC package substrate, but unattached to the IC package substrate;
• prior to attaching the interconnection bumps of the IC die to the package pads of the package substrate and prior to actively applying heat using the one or more heating elements, electrically testing the flip-chip assembly via the test socket pads of the substrate part holder to confirm conductive contacts allowing signal transfer between the IC die and the IC package substrate by placing the interconnection bumps and the package pads in unattached conductive contact to allow signal transfers between the IC die and the IC package substrate.