Wafer level package structure and method of forming same

A method comprising:

• forming a first package comprising:
• attaching a first die to a first interconnect structure;
• forming a first set of electrical connectors on an active surface of the first die;
• forming a plurality of through vias adjacent the first die, each of the plurality of through vias having a first end adjoining the first interconnect structure and a second end extending in a direction away from the first interconnect structure;
• applying a release film over the first set of electrical connectors;
• encapsulating the first die and the plurality of through vias with a molding material, wherein after the encapsulating the first die and the plurality of through vias the molding material is in physical contact with the plurality of through vias;
• planarizing the molding material to expose second ends of the plurality of through vias and at least a portion of the release film;
• forming a second interconnect structure over the molding material, the first set of electrical connectors, and the plurality of through vias, the second interconnect structure being coupled to the first set of electrical connectors and the plurality of through vias;
• and
• attaching a second die to the second interconnect structure using a second set of electrical connectors.

A method comprising:

• attaching a backside surface of a first die to a first side of a first interconnect structure;
• forming a first through via over the first side of the first interconnect structure, the first through via being coupled to the first interconnect structure;
• forming first electrical connectors on an active surface of the first die, the active surface being opposite the backside surface;
• forming a release film over the first electrical connectors and the active surface of the first die;
• encapsulating the first die, the release film, and the first through via with a molding material;
• planarizing the molding material to expose second ends of the plurality of through vias and at least a portion the release film;
• removing the release film to expose the first electrical connectors and the active surface of the first die;
• forming a second interconnect structure over the molding material, the first electrical connectors and the first through via, the first electrical connectors and the first through via being coupled to a first side of the second interconnect structure;
• and
• attaching a second die to a second side of the second interconnect structure using second electrical connectors, the second side of the second interconnect structure being opposite the first side of the second interconnect structure.