Semiconductor element producing method by flattening protective tape
AssigneeFuji Electric Co., Ltd.
InventorAkira Tamenori
Life of this patent
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Abstract
A semiconductor element producing method is disclosed. In the method, a surface protective tape including a base layer and an adhesive layer (including an intermediate layer) is attached to the front surface of a wafer that has unevenness caused by a polyimide passivation. The wafer is placed on a stage, with the surface protective tape facing the stage. The surface protective tape is heated while being drawn to the stage to flatten the surface of the surface protective tape. A grinding process is performed on the rear surface of the wafer to reduce the thickness of the wafer. A rear surface element structure is formed on the rear surface of the wafer, and the wafer is diced into chips.
Claims5
A semiconductor element producing method comprising:
- attaching a tape including a base layer and an adhesive layer, contacting the base layer, to a front surface of a semiconductor wafer that has an uneven portion such that the adhesive layer adheres to the front surface of the semiconductor wafer, with an air bubble remaining between the adhesive layer and the front surface of the semiconductor wafer, such that the tape has a corrugated shape in which the base layer of the tape includes peak-shaped portions over raised portions of the semiconductor wafer and trough-shaped portions between the peak-shaped portions and between the raised portions of the semiconductor wafer;
- and
- heating the tape having the corrugated shape while drawing the tape in a direction in which the tape is separated from the front surface of the semiconductor wafer, the air bubble breaking into a plurality of small air bubbles and the plurality of small air bubbles dispersing in the adhesive layer, and a surface of the corrugated base layer being flattened such that a height difference between the peak-shaped portions and the trough-shaped portions is reduced.
Dependencies are inferred from the claim text.