Process and apparatus for treating surfaces of wafer-shaped articles

An apparatus for processing a wafer, the apparatus comprising:

• a rotary chuck adapted to hold and rotate the wafer about an axis of rotation;
• first and second liquid-dispensing nozzles mounted at a fixed distance from one another, wherein the first liquid-dispensing nozzle is positioned closer to the axis of rotation than the second liquid-dispensing nozzle;
• a liquid supply system configured to supply a same process liquid via a same inlet conduit to the first liquid-dispensing nozzle and the second liquid-dispensing nozzle,
• wherein
• the liquid supply system comprises one or more heaters, and
• the one or more heaters are configured to heat at least one of
• a first portion of the process liquid dispensed from the first liquid-dispensing nozzle to a first temperature, or
• a second portion of the process liquid dispensed from the second liquid-dispensing nozzle to a second temperature, and
• a difference between the first temperature and the second temperature is within a predetermined range;
• and
• a manifold,
• wherein
• the one or more heaters include a single heater,
• the single heater is disposed within the manifold and extends from a first end of the manifold and across the first liquid-dispensing nozzle and the second liquid dispensing nozzle,
• the process liquid enters the manifold at a second end of the manifold, passes across the single heater and to the first liquid-dispensing nozzle and the second liquid-dispensing nozzle,
• the second end is opposite the first end,
• the first liquid-dispensing nozzle is closer to the second end than the second liquid-dispensing nozzle, and
• the single heater heats the first portion of the process liquid more than the second portion of the process liquid.