Package carrier and manufacturing method thereof

A manufacturing method of a package structure, comprising:

• providing a substrate, wherein the substrate has an upper surface and a lower surface opposite to each other, and a through hole connecting the upper surface and the lower surface;
• disposing at least one heat conducting element inside the through hole of the substrate, wherein a thickness of the heat conducting element is smaller than a thickness of the substrate, the heat conducting element is fixed in the through hole by an insulating material and the insulating material is located between the heat conducting element and an inner wall of the through hole, wherein the insulating material has a top surface and a bottom surface opposite to each other, the heat conducting element has a first surface and a second surface opposite to each other, the top surface of the insulating material and the upper surface of the substrate are approximately coplanar, and the bottom surface of the insulating material, the lower surface of the substrate, and the second surface of the heat conducting element are approximately coplanar;
• forming a first patterned circuit layer and a second patterned circuit layer, wherein the first patterned circuit layer is at least formed on the upper surface of the substrate and the top surface of the insulating material and exposes portions of the substrate and the top surface, and the second patterned circuit layer is formed on the lower surface of the substrate and the bottom surface of the insulating material, and exposes portions of the substrate and the bottom surface;
• forming at least one cavity having a depth and extending from the top surface of the insulating material to the heat conducting element, wherein the cavity exposes a portion of the first surface of the heat conducting element, and the first surface of the heat conducting element is lower than the top surface of the insulating material;
• and
• depositing at least one heat generating element in the cavity and on the first surface of the heat conducting element.

A manufacturing method of a package carrier, comprising:

• providing a substrate, wherein the substrate has an upper surface and a lower surface opposite to each other, and at least one through hole connecting the upper surface and the lower surface;
• disposing at least a first heat conducting element and a second heat conducting element inside the at least one through hole of the substrate, wherein a thickness of the first heat conducting element and the second heat conducting element respectively is smaller than a thickness of the substrate, each of the first heat conducting element and the second heat conducting element is respectively fixed in the at least one through hole by an insulating material and the insulating material is at least located between the first heat conducting element and an inner wall of the through hole and between the second heat conducting element and the inner wall of the through hole, wherein the insulating material has a top surface and a bottom surface opposite to each other, the first heat conducting element and the second heat conducting element respectively has a first surface and a second surface opposite to each other, the top surface of the insulating material and the upper surface of the substrate are approximately coplanar, and the bottom surface of the insulating material, the lower surface of the substrate, and the second surface of the first heat conducting element and the second heat conducting element are approximately coplanar;
• forming a first patterned circuit layer and a second patterned circuit layer, wherein the first patterned circuit layer is at least formed on the upper surface of the substrate and the top surface of the insulating material and exposes portions of the substrate and the top surface, and the second patterned circuit layer is formed on the lower surface of the substrate and the bottom surface of the insulating material, and exposes portions of the substrate and the bottom surface;
• and
• forming at least a first cavity and a second cavity respectively extending from the top surface of the insulating material to the first heat conducting element and the second heat conducting element, wherein the first cavity exposes a portion of the first heat conducting element, the second cavity exposes a portion of the second heat conducting element, and a thickness of the first heat conducting element is smaller than a thickness of the second heat conducting element and a depth of the first cavity is greater than a depth of the second cavity.