Method for producing substrate for mounting semiconductor element

A method for producing a substrate for semiconductor element mount using a semiconductor element mounted on a semiconductor element mount portion, the semiconductor element and an electrode terminal portion electrically connected and resin-sealed, and a base substrate, which includes a reprocessed surface, is peeled off and removed, comprising the steps of:

• (1) preparing the base substrate having, on a first metal layer, a second metal layer made of Ni or NiP through which a metal layer for instrumentation is hardly diffusible;
• (2) forming, on the second metal layer of the base substrate, a resist mask layer which has been patterned;
• (3) placing a surface of the second metal layer remaining uncovered off the resist mask layer under reprocessing treatment by any one of soft etching, Ni electroplating after soft etching, and NiP electroplating after soft etching, to form the reprocessed surface;
• (4) providing the reprocessed surface of the base substrate with an organic film that controls adhesion between the metal layer for instrumentation and the reprocessed surface by a liquid agent containing a component that shows a nature of amphoteric surfactant;
• (5) forming the metal layer for instrumentation on the reprocessed surface of the base substrate via the organic film;
• (6) forming, on the metal layer for instrumentation, the semiconductor element mount portion and the electrode terminal portion by electroforming;
• and
• (7) removing the resist mask from the second metal layer of the base substrate.

A method for producing a substrate for semiconductor element mount using a semiconductor element mounted on a semiconductor element mount portion, the semiconductor element and an electrode terminal portion electrically connected and resin-sealed, and a base substrate, which includes a second metal layer, is peeled off and removed, comprising the steps of:

• (1) preparing the base substrate having, on a first metal layer, the second metal layer through which a metal layer for instrumentation is hardly diffusible;
• (2) forming, on the second metal layer of the base substrate, a resist mask layer which has been patterned;
• (3) providing the second metal layer of the base substrate with an organic film that controls adhesion between the metal layer for instrumentation and the second metal layer by a liquid agent containing a component that shows a nature of amphoteric surfactant;
• (4) forming the metal layer for instrumentation on the second metal layer of the base substrate via the organic film;
• (5) forming, on the metal layer for instrumentation, the semiconductor element mount portion and the electrode terminal portion by electroforming;
• and
• (6) removing the resist mask from the second metal layer of the base substrate.