Package structure, fan-out package structure and method of the same

A fan-out package structure, comprising:

• a spiral coil having a depth-to-width ratio greater than 2;
• a redistribution layer (RDL) connected to a top end of the spiral coil;
• and
• a die comprising a plurality of connectors, and a top end of the connectors being coupled to the spiral coil through the RDL;
• wherein the top end of the spiral coil and the top end of the connectors of the die are level with each other.

A package structure, comprising:

• a carrier;
• a spiral coil disposed over the carrier;
• a redistribution layer (RDL) connected to a top end of the spiral coil;
• and
• a molding material fills gaps between the carrier and the RDL;
• a die comprising a plurality if connectors, and a top end of the connectors being coupled to the spiral coil through the RDL;
• wherein the top end of the spiral coil and the top end of the connectors of the die are level with each other.