Free-edge semiconductor chip bending
AssigneeMicrosoft Technology Licensing, LLC
InventorsAndrew Keefe, Geoffrey P. McKnight, Guillermo Herrera
Life of this patent
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Abstract
Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.
Claims15
A method comprising:
- placing a substantially flat semiconductor chip directly on a recessed surface of a mold such that corners or edges of the semiconductor chip are in contact with the mold and are substantially unconstrained;
- after placing the substantially flat semiconductor chip directly on the recessed surface of the mold, placing a non-bonding resilient film atop (i) the substantially flat semiconductor chip and (ii) the recessed surface of the mold such that the non-bonding resilient film is in contact with the mold, wherein the non-bonding resilient film is substantially fluid-impermeable;
- and
- after placing the non-bonding resilient film, bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward a bottom of the recessed surface, wherein the substantially unconstrained corners or edges of the semiconductor chip move with respect to the recessed surface during the bending.
A method comprising:
- arranging a non-bonding resilient film to be adjacent to a substantially flat semiconductor chip;
- placing the non-bonding resilient film and the substantially flat semiconductor chip directly on a recessed surface of a bending jig such that the non-bonding resilient film contacts the bending jig and creates (i) a first region below the non-bonding resilient film and the substantially flat semiconductor chip and (ii) a second region above the non-bonding resilient film and the substantially flat semiconductor chip, wherein the first region includes a concave surface;
- and
- adjusting pressures of the first region and/or the second region so that pressure of the second region is greater than pressure of the first region such that (i) the non-bonding resilient film and the substantially flat semiconductor chip bend toward the concave surface to produce a curved semiconductor chip, and (ii) edges or corners of the semiconductor chip move relative to the concave surface.
Dependencies are inferred from the claim text.