Substrate bonding apparatus and substrate bonding method
AssigneesTadatomo Suga, Bondtech Co., Ltd.
InventorsTadatomo Suga, Akira Yamauchi
Life of this patent
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Abstract
A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).
Claims25
A substrate bonding apparatus, comprising:
- a vacuum chamber;
- a surface activation part for irradiating two bonding surfaces of two substrates with a particle beam to thereby activate said two bonding surfaces and irradiating at least one bonding surface with silicon particles in parallel with irradiation with said particle beam in said vacuum chamber;
- and
- a substrate moving mechanism for bringing said two bonding surfaces into contact with each other, to thereby bond said two substrates.
A substrate bonding method, comprising:
- a) irradiating two bonding surfaces of two substrates with a particle beam to thereby activate said two bonding surfaces and irradiating at least one bonding surface with silicon particles in parallel with irradiation with said particle beam in a vacuum chamber;
- and
- b) bringing said two bonding surfaces into contact with each other, to thereby bond said two substrates.
Dependencies are inferred from the claim text.