Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsKoji Kagawa, Hisashi Kawano, Meitoku Aibara, Yuki Yoshida
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AssigneeTokyo Electron Limited
InventorsKoji Kagawa, Hisashi Kawano, Meitoku Aibara, Yuki Yoshida
Estimating the term…
In order to remove from a substrate having a concavo-convex pattern formed on a surface of the substrate, a solid material with which a concave portion of the concavo-convex pattern is filled and which is formed by evaporating a solvent in a sublimable substance solution containing a sublimable substance that sublimates at a temperature equal to or higher than a first temperature, and an impurity that evaporates at a temperature equal to or higher than a second temperature that is higher than the first temperature, the prevent invention provides a substrate processing apparatus and a substrate processing method which heat the substrate to a temperature equal to or higher than the second temperature.
A substrate processing method for removing from a substrate having a concavo-convex pattern formed on a surface of the substrate, a solid material with which a concave portion of the concavo-convex pattern is filled,
Dependencies are inferred from the claim text.